http://www.rssboard.org/rss-specification AnandTech This channel features the latest computer hardware related articles. http://www.anandtech.com en-us Copyright 2019 AnandTech Anand Lal Shimpi https://imchealthcheckup.com/?win=contenthttps://www.anandtech.com/images/rss_logo.png AnandTech http://www.anandtech.com ASUS Announces New ROG Phone II: 120Hz OLED, 6000mAh & Snapdragon 855+ Andrei Frumusanu

Today ASUS is releasing the successor to last year’s enthusiast-level gaming phone – the ROG Phone. This year’s model features the same DNA that the original model was built on- but this time around ASUS went for bigger and better in every regard, upgrading the new ROG Phone II with some new impressive hardware, creating quite a beast of a phone.

ASUS’s rationale for releasing a gaming-focused phone is that the mobile market is seeing some exceptional annual growth, with mobile accounting for 47% of the total gaming market world-wide, with a healthy growth of 12.8% for mobile and specifically a 14.2% year-on-year growth for smartphone gaming. As such, ASUS sees a large opportunity to carve out a niche in the market in terms of offering a phone that maxes out the mobile gaming experience.

ASUS ROG Phones
  ROG Phone ROG Phone II
SoC Snapdragon 845 (OC)
4x Cortex-A75 @ 2.96GHz
4x Cortex-A55 @ 1.80GHz


Adreno 630 @ MHz
Qualcomm Snapdragon 855+ 
1x Cortex-A76 @ 2.96GHz
3x Cortex-A76 @ 2.42GHz
4x Cortex-A55 @ 1.80GHz

Adreno 640 @ 675MHz
DRAM 8 GB LPDDR4X 12 GB LPDDR4X
Storage 128 / 512GB UFS 2.1 <= 512GB UFS 3.0
Display 6.0" AMOLED
2160 x 1080 (18:9)
90Hz

 
6.59" AMOLED
2340 x 1080 (19.5:9)
120Hz

240Hz Touch
Size Height 158.8 mm 170.99 mm
Width 76.2 mm 77.6 mm
Depth 8.6 mm 9.48 mm
Weight 200 grams 240 grams
Battery Capacity 4000mAh 6000mAh
Wireless Charging -
Rear Cameras
Main 12MP 48MP IMX586
0.8µm pixels (1.6µm 4:1 12MP)
Telephoto - -
Wide 8MP
120° wide-angle
13MP
125° wide-angle
Extra - -
Front Camera 8MP 24MP
I/O USB-C 3.1

3.5mm headphone
Wireless (local) 802.11ac Wave 2 Wi-Fi
Bluetooth 5.0 LE + NFC

802.11ad (Wireless display)
   
Other Features Dual Stereo Speakers
Dual-SIM Dual nanoSIM
Colours    
Launch Price 128GB $899   ????
512GB $1099 512GB ????

At the heart of the new ROG Phone II is the Snapdragon 855. But this isn’t your regular S855 we’ve seen from other flagships so far this year, but rather a new SKU bin called the Snapdragon 855+. The new variant upgrades the clocks on the CPU and particularly on the GPU. On the CPU side we’re seeing the Prime core being overclocked from 2.84GHz to 2.96GHz, giving a 4% boost in some single-threaded applications, whilst the new GPU sees a larger 15% performance boost being upgraded from 585MHz to 675MHz.

Whilst the new increased GPU performance of the chip brings a new healthy upgrade to the experience, what really makes the new ROG Phone II differ from other devices is ASUS’ new improved thermal dissipation capabilities as well as its sustained performance claims. The company claims that the phone is able to maintain its peak performance significantly better than other smartphones, suffering much less degradations from thermal throttling.

Other internal hardware upgrades includes the upgrade from 8GB LPDDR4X in the original to now 12GB in the ROG Phone II.

ASUS also follows other vendors in terms of adopting the new UFS 3.0 storage standard which promises to double the theoretical peak transfer rates. The ROG Phone II still maintains a maximum of 512GB of storage in this regard.


Source: Android Central

What’s most impressive about the new device though is its sheer size. This is now a much bigger phone than last year’s original, raising the screen diameter from 6.0” to 6.59”. Although some of the increased diameter is due to the stretching of the aspect ratio from 18:9 to 19.5:9, the overall phone still is much bigger as it gains 12.19mm in height to 170.99mm, 1.4mm in width to 77.6mm and is now 10% thicker at 9.48mm.

The thickness is especially interesting as the new phone now houses a whopping 50% bigger battery, which now reaches 6000mAh. The physical aspect where this is most noticeable in the phone is in its weight which grows from 200g to 240g, marking the new ROG Phone II as quite the heavy unit.

The vastly increased battery capacity is an important feature of the phone as it allows for significantly longer gaming sessions and ASUS promises the phone to last much longer than competing devices when playing high-end games.


Source: Android Central

Of course the new size isn’t the only upgraded aspect of the new screen: ASUS continues to use an AMOLED display, but now further pushes the boundaries in terms of refresh rate by going from 90Hz in the original to a new 120Hz panel. The resolution still remains 1080p with the only upgrade being a few more pixels to fit the stretched the elongated aspect ratio. At this size the resolution might not be the sharpest amongst the competition, but for a gaming-centric smartphone it’ll still provide excellent performance in essentially any games currently available.

ASUS has also improved the touch aspects of the phone: As far as I’m aware, this is the first ever 240Hz touch controller in a smartphone. What this has allowed ASUS to do is vastly improve the touch latency compared to any other smartphone by significant margins, which together with the new 120Hz display panel should result in some excellent fluidity and smoothness.

On the camera side of things, the ROG Phone II seems to adopt the Zenfone 6’s setup which includes the Sony IMX586 48MP camera sensor module as well as a 13MP wide-angle camera. ASUS hasn’t gone into details of the camera but we largely expect it to match the performance of its sibling device. The front camera has also been upgraded from 8MP to 25MP.

Much like on the original ROG Phone, ASUS will be offering a slew of different accessories for the new ROG Phone II. The phone itself comes with an additional connector on the side of the device to which the accessories can connect to, offering similar features and additions as last year’s line-up.

The ROG Phone II launches in China on July 23rd with a glossy back, whilst the worldwide variant will be available in the first week of September in a matte black back. No pricing available as of yet.

Device images courtesy of Android Central

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https://imchealthcheckup.com/?win=show/14662/asus-announces-rog-phone-ii Mon, 22 Jul 2019 06:00:00 EDT tag:www.anandtech.com,14662:news
AMD Joins CXL Consortium: Playing in All The Interconnects Anton Shilov

AMD's CTO, Mark Papermaster, has published a blog post this week said that AMD has joined the Compute Express Link (CXL) Consortium. The industry group is led by a set of nine industry giants such as Intel, Alibaba, Google, and Microsoft. The CXL 1.0 technology uses the PCIe 5.0 physical infrastructure to enable a coherent low-latency interconnect protocol that allows to share CPU and non-CPU resources efficiently and without using complex memory management. The announcement indicates that AMD now supports all of the current and upcoming high-speed interconnect protocols, including CCIX, Gen-Z, and OpenCAPI.

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https://imchealthcheckup.com/?win=show/14660/amd-joins-cxl-consortium-a-coherent-inteldeveloped-pcie-50based-io Fri, 19 Jul 2019 17:00:00 EDT tag:www.anandtech.com,14660:news
Western Digital Unveils IntelliFlash N5100: An Entry-Level All-Flash Storage System Anton Shilov

Western Digital has introduced its most affordable NVMe all-flash storage array, the new IntelliFlash N5100. The device offers up to 92 TB of raw NAND flash using SN200 NVMe SSDs, and can be further expanded when needed using additional 2U IntelliFlash SAS modules featuring 24 SAS drive bays, offering hundreds of terabytes of raw NAND flash. The IntelliFlash N5100 is aimed at customers who need to accelerate business applications, but who do not need extreme levels of performance at high prices.

Western Digital’s IntelliFlash N-series NVMe all-flash arrays sit above the company’s IntelliFlash HD-series all-flash and T-series hybrid-flash offering the lowest latency of around 200 µsec and the highest data transfer rates. The N-series family contains three types of arrays: the highest-end N5800, the mainstream N5200, and now the entry-level N5100. The top-of-the-range N5800 offers up to 1.7M sustained IOPS and up to 23 GB/s data throughput, the midrange N5200 provides up to 800K IOPS, whereas the entry-level N5100 features up to 400K sustained IOPS.

Western Digital's IntelliFlash N-series
  N5100 N5200 N5800
Random Read/Write Performance 400K IOPS 800K IOPS 1.7M IOPS
Sustained Data Transfer Rate ? ? 23 GB/s
Latency 200 µsec 200 µsec 200 µsec
Maximum RAW Capacity 400 TB 1.4 PB 2.5 PB

All the Western Digital IntelliFlash N-series all-flash arrays are based on Intel’s Xeon processors, and use WD's dual-active controller architecture in a 2U form-factor. The N5100-series AFAs can be expanded using 2U SAS-based HD-series AFAs that carry SSDs with up to 15.36 TB capacity (Ultrastar DC SS530) and providing up to 368 TB of raw NAND flash (in case of the HD2160 version) as well as 1 ms latency. Meanwhile, the IntelliFlash N5800 can support multiple IntelliFlash HD or 2U or 3U machines for a total raw NAND capacity of up to 2.5 PB.

From software standpoint, all the latest IntelliFlash machines run Western Digital’s IntelliFlash OE 3.10 operating system that supports block (FC, iSCSI) as well as file (NFS, CIFS, SMBv3) protocols and therefore are compatible with a variety of software from multiple vendors. Furthermore, the OS fully supports virtualization, data protection, data reduction, inline deduplication, and compression to improve performance, reliability, and increase effective capacity.

Interestingly, the IntelliFlash OE 3.10 adds support for Storage Class Memory as well as NVDIMMs to further boost their performance, but Western Digital does not disclose what kind of SCE and NVDIMMs are currently supported or which future configurations will be supported.

Western Digital’s IntelliFlash N5100 AFAs will be available in the near future. Actual pricing will depend on exact configurations.

Related Reading:

Source: Western Digital

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https://imchealthcheckup.com/?win=show/14659/western-digital-unveils-intelliflash-n5100-an-entrylevel-allflash-storage-system Fri, 19 Jul 2019 12:00:00 EDT tag:www.anandtech.com,14659:news
Corsair Unveils 32 GB Vengeance LPX DDR4 DIMMs, 64 GB & 128 GB Dual-Channel Kits Anton Shilov

Corsair has introduced its first 32 GB unbuffered DRAM modules along with 64 GB and 128 GB dual-channel memory kits for mainstream PC platforms based on AMD’s 400/500-series as well as Intel’s 300-series chipsets (and their successors). Besides, the company also unveiled its 256GB eight-channel kit for high-end desktop as well as extreme workstation processors.

Corsair’s Vengeance LPX DDR4 unbuffered memory modules are based on 16 Gb memory chips (from an unconfirmed vendor, though Corsair historically relies on devices from Samsung) as well as the company’s custom 10-layer PCB designed to ensure quality signaling when operating at higher clocks. Traditionally for this product family, Corsair’s 32 GB Vengeance LPX UDIMMs are equipped with black anodized aluminum heat spreaders.

Set to be available in kits containing one, two, four, or eight 32 GB unbuffered DIMMs, Corsair’s Vengeance LPX modules are rated for DDR4-2400 CL16 16-16-39 at 1.2 V, DDR4-2666 CL16 18-18-35 at 1.2 V, and DDR4-3000 CL16 20-20-38 at 1.35 V modes. It is noteworthy that the modules come with SPD programmed for DDR4-2133 CL15 mode, but since they feature XMP 2.0 profiles, setting correct speeds should be easy.

Corsair Vengeance LPX DDR4 Kits Featuring 32 GB UDIMMs
Data rate Latency Kit Capacity Modules Voltage Heat Spreader Launch Price
2400 MT/s CL16
16-16-39
32 GB 1 × 32 GB 1.2 V Black $149.99
64 GB 2 × 32 GB $299.99
128 GB 4 × 32 GB $599.99
256 GB 8 × 32 GB $1,199.99
2666 MT/s CL16 18-18-35 32 GB 1 × 32 GB 1.2 V $154.99
64 GB 2 × 32 GB $304.99
128 GB 4 × 32 GB $609.99
256 GB 8 × 32 GB ?
3000 MT/s CL16 20-20-38 32 GB 1 × 32 GB 1.35 V ?
64 GB 2 × 32 GB ?

Corsair’s 32 GB Vengeance LPX DDR4 unbuffered memory modules as well as kits on their base are available today directly from Corsair and will shortly be available from the company’s partners. One 32 GB DDR4-2400/DDR4-2666 module is priced at $149.99/$154.99; but dual, quad, and eight-channel kits are naturally more expensive.

Related Reading:

Source: Corsair

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https://imchealthcheckup.com/?win=show/14658/corsair-unveils-32-gb-vengeance-lpx-ddr4-dimms-64-gb-128-gb-dualchannel-kits Fri, 19 Jul 2019 11:00:00 EDT tag:www.anandtech.com,14658:news
Patriot Launches P200 SSDs with Maxio and Silicon Motion Controllers: From $31.99 Anton Shilov

Patriot has introduced its new family of entry-level SATA SSDs offering capacities from 256 GB to 2 TB. The P200-series drives use controllers from Maxio Technology and Silicon Motion, the first time in years that Patriot uses controllers not from Phison.

Available in a 2.5-inch/7 mm form-factor, the Patriot P200 drives feature 256 GB, 512 GB, and 1 TB configurations and are based on Silicon Motion’s SM2258XT controllers, whereas the top-of-the-line 2 TB model is powered by Maxio Technology’s MAS0902A controller. The drives are powered by 3D NAND memory, but the manufacturer does not disclose exact model of chips or their manufacturer (we do know that SMI and Maxio controllers can work with memory from various vendors though).

As far as performance is concerned, Patriot says that its P200-series SSDs can offer up to 530 MB/s sequential read speeds, up to 460 MB/s sequential write speeds, up to 90K random read IOPS, as well as up to 80K random write speeds. Performance wise, the new drives from Patriot offer similar speed levels as other SATA 6 Gbps SSDs.

When it comes to endurance levels, Patriot’s P200 SSDs can offer 0.45 – 0.58 drive writes per day (DWPD), which is actually higher when compared to 0.3 DWPD offered by cheap 3D QLC NAND-based drives these days.

All Patriot’s P200 SSDs are covered by a three-year warranty and are available now for $31.99 - $189.99, depending on capacity.

Patriot's P200 Specifications
Capacity 256 GB 512 GB 1 TB 2 TB
Model Number P200S256G25 P200S512G25 P200S1TB25 P200S2TB25
Controller Silicon Motion SM2258XT Maxio MAS0902A
NAND Flash 3D NAND
Form-Factor, Interface 2.5-inch/7-mm, SATA 6 Gbps
Sequential Read up to 530 MB/s
Sequential Write up to 460 MB/s
Random Read IOPS up to 90K
Random Write IOPS up to 80K
Pseudo-SLC Caching Supported
DRAM Buffer No
AES Encryption unknown
Power Management Automatic sleep and wake-up mechanism power saving
Warranty 3 years
MTBF 2,000,000 hours
TBW 160 TB 320 TB 640 TB 1000 TB
DWPD 0.57 0.57 0.58 0.45
Price at Launch $31.99 $49.99 $87.99 $189.99

Related Reading:

Source: Patriot

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https://imchealthcheckup.com/?win=show/14653/patriot-launches-p200-ssds-with-maxio-and-silicon-motion-controllers-from-3199 Thu, 18 Jul 2019 13:00:00 EDT tag:www.anandtech.com,14653:news
Intel’s Xeon Platinum 8284 CPU: When 300 MHz Cost $5,500 Anton Shilov

Besides Xeon processors that are officially mentioned on its website and price list, Intel has tens of ‘off roadmap’ server CPUs only available to select customers that have special requests. Recently journalists from ComputerBase discovered that Intel has Xeon Platinum 8284, the company’s fastest 28-core chip for multi-socket servers. The CPU runs 300 MHz faster than the ‘official’ Xeon Platinum 8280, but costs considerably more.

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https://imchealthcheckup.com/?win=show/14656/intels-xeon-platinum-8284-cpu-when-300-mhz-cost-5500 Thu, 18 Jul 2019 12:00:00 EDT tag:www.anandtech.com,14656:news
The MSI MEG X570 Ace Motherboard Review: Ace in the Hole at $369 Gavin Bonshor In our first X570 motherboard review we have the MSI MEG X570 Ace. This motherboard represents MSI's high-end range and sits in the top 3 of its product stack. The MEG X570 Ace has a black and gold theme which fits in with AMD's 50 year anniversary, and also includes an 'Infinity Mirror' on the rear panel cover. It's a beefy looking product, and the Ace has a trump card of a price tag of $369 as it offers enthusiast-level features such as a 2.5G Ethernet, a true 12+2-phase power delivery, and three PCIe 4.0 x4 M.2 slots, all at a fairly reasonable price.

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https://imchealthcheckup.com/?win=show/14603/the-msi-meg-x570-ace-motherboard-review Thu, 18 Jul 2019 11:00:00 EDT tag:www.anandtech.com,14603:news
Samsung Starts Production of LPDDR5-5500 Devices: 12 GB of DRAM in a Smartphone Anton Shilov

Samsung has kicked off volume production of its LPDDR5 memory devices and intends to start mass assembly of memory packages based on the new DRAMs. The company’s LPDDR5 memory will be used for upcoming flagship smartphones with up to 12 GB of memory in the coming months.

Samsung’s 12 Gb LPDDR5 memory devices feature a 5500 MT/s data transfer rate, which is about 30% higher when compared to currently used LPDDR4X-4266 DRAM. One of the first products to use the new 12 Gb LPDDR5 devices will be Samsung’s 12 GB LPDDR5 package featuring a 44 GB/s bandwidth.

The manufacturer produces its 12 Gb LPDDR5 chips using its 2nd Generation 10 nm-class process technology that enables it to make the new chips smaller (i.e., cheaper) and more power efficient, yet Samsung does not disclose exact voltages of these new DRAMs. What we do know is that the ICs feature a variable voltage that is up to 1.1 V. The producer claims that its LPDDR5 devices are 30% more power efficient than existing mobile memory chips because of a new circuit design with enhanced clocking, a new deep sleep mode, as well as low-power feature that guarantees stable operation at high clocks.

Assembly of 12 GB LPDDR5-5500 packages will commence later in July, which indicates that the company expects demand for these products in the coming months. Quite naturally, Samsung does not disclose customers interested in 12 GB of LPDDR5 memory, but there are a number of new flagship smartphone launches scheduled for the coming months, so we are going to find out soon. We do expect that Samsung is starting to build inventory for new 1Q2020 device launches which will have next-generation LP5 compatible SoCs in them as well.

Next year Samsung plans to release 16 Gb LPDDR5 devices and eventually increase data transfer rates of its LPDDR5 DRAMs all the way to 6400 MT/s. Meanwhile, as demand for LPDDR5 increases, Samsung may transfer production of this memory to its massive campus near Pyeongtaek, South Korea.

Related Reading:

Source: Samsung

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https://imchealthcheckup.com/?win=show/14655/samsung-starts-production-of-lpddr55500-devices-12-gb-of-dram-in-a-smartphone Thu, 18 Jul 2019 11:00:00 EDT tag:www.anandtech.com,14655:news
European Commission Fines Qualcomm €242m For Anti-trust Violations Andrei Frumusanu

Today the European Commission has concluded a 4 year long antitrust investigation into anti-competitive business behaviour of Qualcomm against other players in the market, and has fined the company €242 million for abusing its market dominance in 3G baseband chipsets during the period of 2009 to 2011.

The investigation was formally opened on July 16th 2015 and particularly looked at Qualcomm’s behaviour in the late 3G/UMTS and early 4G era where it held a commanding lead over other vendors in supplying modem chipsets.

The Commission concluded that Qualcomm had engaged in predatory pricing of three chipsets with evidence that the company had aimed to strategically push out and eliminate new contenders in the market, with a specific mention of Icera.

The Commission goes into more detail in regards to Qualcomm’s pricing behaviour in the mid-2009 to mid-2011 period where it concluded that it sold UMTS chipsets below cost to Huawei and ZTE, two important customers, with the goal of eliminating Icera.

Icera was an up-and-coming UMTS and LTE vendor which had started to see success in the market, and ended up being acquired by Nvidia with plans of integrating the technology into the Tegra line-up of SoCs, one product of this venture ending up being the Tegra 4i. The Tegra 4i unfortunately saw very little success among vendors in the market even though the chipset was technically equivalent to the Snapdragon 800/801 SoCs at the time. Nvidia ended up shuttering the division in 2015 due to a lack of success.

Qualcomm has communicated that the company is planning to appeal the finding.

The fine comes shortly after a recent scathing ruling in the US where the FTC had accused the company of similar anti-competitive behaviour breaching antitrust laws, and several years of scrutiny and fines by several regulatory agencies of various countries around the world.

Related Reading:

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https://imchealthcheckup.com/?win=show/14654/european-commission-fines-qualcomm-242m Thu, 18 Jul 2019 09:30:00 EDT tag:www.anandtech.com,14654:news
Toshiba Memory To Rebrand As Kioxia Billy Tallis

In 2017, Toshiba was forced to sell off its flash memory business to stave off bankruptcy. The memory business was spun off as Toshiba Memory Corporation and sold for $18 billion to a consortium led by Bain Capital after a high-stakes bidding war. Toshiba Memory has continued to thrive as the number two manufacturer of NAND flash memory and a major player in the SSD market. Toshiba Memory has been laying the groundwork for an IPO that could happen as early as November of this year. Part of that preparation includes establishing a more independent identity form the Toshiba conglomerate that only retained about 40% ownership of the memory business.

To that end, Toshiba Memory will be rebranding as Kioxia at the beginning of October. Toshiba says the new name is a combination of kioku (Japanese for "memory") and axia (Greek for "value"). The announcement of the new name doesn't include any strategy shifts, only generic corporate platitudes. On the technology side, it's still business as usual save for recovering from the effects of a recent power outage at their fabs in Yokkaichi, Japan. On the financial side, details of their plans for an IPO are still largely unofficial and the timing may still be influenced by changing market conditions. When the Bain-led consortium acquired Toshiba Memory in 2017, the original plan was for an IPO to occur within three years, and it looks like they are on track to meet that deadline.

Related Reading:

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https://imchealthcheckup.com/?win=show/14652/toshiba-memory-to-rebrand-as-kioxia Thu, 18 Jul 2019 08:00:00 EDT tag:www.anandtech.com,14652:news
Club 3D’s CSV-1562 USB Type-C Dock Has Three 4K Display Outputs Anton Shilov

Club 3D has announced its new 15-in-1 USB Type-C docking station which has a total of five display outputs that can drive up to three 4K Ultra-HD monitors. The new CSV-1562 uses display output chips from DisplayLink to enable multiple display connectors, which can add unique capabilities to mainstream notebooks without discrete GPUs.

Aimed at mobile professionals who need multiple ports and many displays, the Club 3D CSV-1562 USB 3.1 Gen 1 Type-C docking station integrates a GbE adapter, five USB 3.1 Gen 1 Type-A ports, one USB 3.1 Gen 1 Type-C connector (that can charge mobile phones), five display outputs (three HDMI 2.0 and two DisplayPort 1.2 connectors), a 3.5-mm audio output, and a 3.5-mm microphone input. In addition, the USB-C dock has a built-in PSU and can deliver up to 60 W of power to its host laptop.

The key feature of the Club 3D CSV-1562 is of course its graphics output capabilities enabled by a USB-based DisplayLink controller. Two out of five outputs can drive two 4K60 monitors, another one can drive a 4K30 display. Alternatively, two DisplayPorts can be used to connect a 5K60 monitor. Because we are talking about a DisplayLink-based solution, the CSV-1562 needs appropriate Virtual Graphics Card (VGC) software/drivers that takes the virtual framebuffer, compresses it and sends the data over USB to the company's proprietary Hardware Rendering Engine (HRE) that converts it to display signals. DisplayLink's software thus naturally consumes some computer resources and has certain requirements.

Being a unique USB-C docking solution, the Club 3D CSV-1562 is not cheap at all, but if you have a USB-C laptop yet need to run two or three 4K monitors, you do not really have much of a choice. The unit is currently available in Japan for ¥29,800 (so think about MSRP of around $250 in the USA).

Related Reading:

Source: Club 3D (via PC Watch)

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https://imchealthcheckup.com/?win=show/14650/club-3ds-csv1562-usb-typec-dock-has-three-4k-display-outputs Wed, 17 Jul 2019 16:00:00 EDT tag:www.anandtech.com,14650:news
ID Cooling IS-50X Low-Profile SFF Cooler, Rated for 130 W TDP Anton Shilov

ID Cooling has introduced its new cooling system designed for small form-factor (SFF) PCs, for CPUs with a TDP rating of up to 130W. The IS-50X has a 120-mm fan and is just 57 mm tall, and is designed for desktops builds featuring higher-end processors from AMD or Intel with six or eight cores that can dissipate a lot of thermal energy.

Traditionally, CPU coolers for smaller systems are designed for mainstream chips have a TDP between 35W to 65W. Since demand for high-performance SFF PCs is on the rise, manufacturers are developing coolers that can handle processors with TDP levels that exceed 95W. Such devices usually feature multiple heat pipes along with more sophisticated fans. For example, the IS-50X comes with five 6-mm heat pipes as well as a 120-mm PWM fan with 13 curved blades that rotates at a speed of 600 – 1600 RPM. The fan can produce airflow of up to 53.6 CFM and has a maximum load noise level of only 30.2 dB(A).

When it comes to compatibility, the ID Cooling IS-50X cooler is compatible with all contemporary platforms from AMD and Intel, including the latest AM4 and LGA1155 sockets.

The ID Cooling IS-50X Specifications
  IS-50X
CPU TDP 130 W
Material Copper heatpipes aluminum fins
Dimension with Fan 120 mm (W) × 57 mm (H) × 122 mm (D)
Heat Pipes 5 × 6 mm heat pipes
Air Pressure ~ 1.36 mm H2O
Air Flow (CFM)  53.6 CFM
Speed  600 ~ 1600 RPM
Noise 13 ~ 30.2 dBA
Type of Bearing Hydraulic bearing
Life Expectancy ?
Weight 310 grams
Compatibility AMD AM4/FM2+/FM2/FM1/AM3+/AM3/AM2+/AM2
Intel LGA1151/1150/1155/1156

ID Cooling is one a few companies which offers high-performance CPU coolers for SFF PCs. Earlier this year the firm introduced its 30-mm high IS-30 cooler for processors with TDP levels of up to 100 W. The new IS-50X is naturally considerably larger, but it can better handle processors that are either overclocked, or run at higher Turbo clocks when possible.

ID Cooling did not disclose pricing of the IS-50X cooler this week, but its IS-50 unit was available for $33.39 (down from $52.99) from Newegg at press time.

Related Reading:

Source: ID Cooling (via Tom’s Hardware)

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https://imchealthcheckup.com/?win=show/14649/id-cooling-is-50x-lowprofile-sff-cooling-rated-for-130-w-tdp Wed, 17 Jul 2019 15:00:00 EDT tag:www.anandtech.com,14649:news
Nintendo Announces New Version of Switch with Longer Battery Life Anton Shilov

Nintendo has announced a new version of its Switch game console that features a considerably longer battery life than the first-generation model. The new console likely uses new components that feature a lower power consumption and therefore the gaming device can work for longer durations on one charge.

The new Nintendo Switch console has the same features as the original one (handheld mode, tabletop mode, TV mode, Joy-Con controllers, etc.) and looks exactly the same too. The company does not disclose precise specifications of the unit, but only says it can work for 4.5 – 9 hours on one charge, up from 2.5 – 6.5 hours in case of the previous-gen model.

Since it is hard to increase capacity of a battery by 80% in a short period of time without increasing its physical dimensions, it is more than likely that the product is actually based on a version of NVIDIA’s Tegra X1 SoC made using a more advanced (12 nm or 16 nm) process technology and featuring the same lower power consumption that we reported about a week ago on the new Switch Lite.

Since the new model with better battery life looks the same, it remains to be seen how Nintendo plans to differentiate between the two versions of its Switch consoles from the older ones in terms of hardware packaging. The original version carries the HAC-001 model number (with serial numbers starting from XAW), whereas the new SKUs will feature the HAC-001(01) model number (with serial numbers beginning from XKW).

The new Nintendo Switch game console will carry the same $299.99 MSRP as the original device and will be available in the near future.

Related Reading:

Source: Nintendo, Nintendo Twitter (via Gizmodo)

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https://imchealthcheckup.com/?win=show/14651/nintendo-announces-new-version-of-switch-with-longer-battery-life Wed, 17 Jul 2019 14:00:00 EDT tag:www.anandtech.com,14651:news
HP Launches Z6 G4 Workstation with Intel Xeon Scalable & Quadro RTX 6000 Anton Shilov

HP has started sales of its fourth-generation Z6 workstation, which pack one or two of Intel’s Xeon Scalable processor, NVIDIA’s Quadro RTX graphics cards, as well as up to 384 GB of memory. The new HP Z6 G4 machine is designed for graphics and compute intensive workloads and is aimed at VFX specialists, engineers and other creative professionals.

HP’s Z6 G4 workstation is based on one Intel Xeon W CPU or two Intel Xeon Scalable processors, with up to 48 cores in total. The machine can integrate up to 384 GB of DDR4 memory with ECC as well as six PCIe add-in-boards. Since the workstation has two PCIe 3.0 x16 slots, it can also feature two NVIDIA Quadro RTX 6000 graphics cards. In addition, the system can pack multiple SSDs and HDDs that offer tens of terabytes of storage space.

The key feature of HP’s Z6 G4 is its expandability and upgradeability. It may be configured with one Xeon W processor, but may be eventually upgraded to two Xeon Scalable CPUs using a special module. The machine comes with a 1000 W power supply, enough to feed the most power-hungry components.

HP’s Z6 workstations cost starting from $1,829 and sit between the company’s top-of-the-range dual-processor Z8 machine with up to four Quadro RTX 8000 graphics cards (which costs $2,489 and higher) as well as a more compact and affordable Z4 with two graphics cards that starts at $1359.

Like all HP Z workstations, the Z6 G4 comes with the company’s Sure Start self-healing BIOS capability, HP Sure Run security feature, HP Sure Recover  as well as a three-year warranty.

Related Reading:

Source: HP

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https://imchealthcheckup.com/?win=show/14647/hp-launches-z6-g4-workstation-with-intel-xeon-scalable-quadro-rtx-6000 Wed, 17 Jul 2019 09:00:00 EDT tag:www.anandtech.com,14647:news
Giveaway: Seagate Ironwolf 110 SSD (480GB) Ryan Smith

We haven’t yet given away any hardware this summer, so let’s change that. Earlier this year Seagate announced that they’d be expanding their Ironwolf family of NAS-focused drives to include SATA SSDs, and to that end the company has sent over a 480GB drive for us to give away.

As noted by Ganesh earlier this year when the drives launched, the Ironwolf 110 family the recent drop in NAND pricing has opened the door to SSDs becoming increasingly viable for NASes, especially as cache drives. SMBs and SMEs have already been using enterprise SSDs for this purpose, and Seagate believes that there is a market for SSDs specifically targeting the NAS market, as long as it is at the right price point.

With capacities ranging from 240GB to 3.84TB, Seagate is offering a fairly expansive family with the Ironwolf 110. The drives, based on 3D TLC NAND with sustained performance numbers of 560 / 535 MBps sequential reads / writes, support a relatively hearty 1 DWPD endurance, despite the usual read-heavy scenarios that NASes drive.  Fittingly, since SSDs offer higher reliability due to a lack of moving parts, the rated nonrecoverable read errors rate is 1 per 10E17, 2 orders of magnitude better than the typical Ironwolf HDD.

Seagate Ironwolf 110 Series Specifications
Capacity 240 GB 480 GB 960 GB 1920 GB 3840 GB
Form Factor 2.5" 7mm SATA
NAND Flash 3D TLC
Sequential Read 560 MB/s
Sequential
Write
345 MB/s 535 MB/s
Random Read 55k IOPS 75k IOPS 90k IOPS 90k IOPS 85k IOPS
Random
Write
30k IOPS 50k IOPS 55k IOPS 50k IOPS 45k IOPS
Idle Power 1.2 W
Active Power 2.3 W 2.7 W 3.2 W 3.4 W 3.5 W
Warranty 5 years
Write
Endurance
435 TB
1 DWPD
875 TB
1 DWPD
1750 TB
1 DWPD
3500 TB
1 DWPD
7000 TB
1 DWPD

Ultimately, Seagate is hoping to sell the IronWolf SSDs to prosumers, creative pros, SMB, and SME NAS users. Prosumers and creative professionals with 10G-capable NAS units stand to benefit from the bandwidth benefits of flash-equipped bays. While enterprise SSDs are the way to go for all-flash arrays with write-heavy workloads, other SSD-in-NAS use-cases in the SMB and SME space can benefit from SSDs such as the IronWolf 110.

This giveaway is running through July 26th and is open to all US residents. To enter, please visit our Gleam.io contest entry page.

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https://imchealthcheckup.com/?win=show/14646/giveaway-seagate-ironwolf-110-ssd-480gb Tue, 16 Jul 2019 14:30:00 EDT tag:www.anandtech.com,14646:news
The Kinesis Freestyle Edge RGB Gaming Mechanical Keyboard Review: An Ergonomic Masterpiece E. Fylladitakis Today we are taking a look at the Freestyle Edge RGB, the successor to the the first ergonomic mechanical keyboard that we ever reviewed, the Freestyle Edge. Although its name suggests that the company just added RGB lighting to the initial version of the keyboard, as we'll see in this review, Kinesis has made several and significant changes to the overall Freestyle Edge design.

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https://imchealthcheckup.com/?win=show/14642/the-kinesis-freestyle-edge-rgb-gaming-mechanical-keyboard-review Tue, 16 Jul 2019 13:30:00 EDT tag:www.anandtech.com,14642:news
Arm Flexible Access: Design the SoC Before Spending Money Dr. Ian Cutress

One of the critical ways in which the Arm licensing model works relates to how its customers acquires Arm’s IP, the architecture licenses, or access, along with royalty payments. Every customer, especially the big ones on the leading edge, is different, and we’ve gone through how the Arm business model works in detail in a series of articles back in 2013. Today, Arm is taking a different step in how vendors can approach most of its popular IP for the simple task of design - without having to open the wallet to buy a license.

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https://imchealthcheckup.com/?win=show/14644/arm-flexible-access-design-the-soc-before-spending-money Tue, 16 Jul 2019 09:00:00 EDT tag:www.anandtech.com,14644:news
AMD’s Eight-Core Ryzen 7 2700X Now Available for $200 Anton Shilov

As a part of Prime Day deals at Amazon, AMD’s eight-core Ryzen 7 2700X processor is now available for $199.99, which is $129 off its original MSRP. This is the lowest price for this eight-core processor with an unlocked multiplier ever.

AMD’s Ryzen 7 2700X is the company’s former flagship CPU that has eight cores with SMT, features a 16 MB L3 cache and runs at 3.7 GHz default clocks. The chip also has two DDR4-2933 memory channels and is compatible with modern AM4 motherboards that are available widely and at different price points. Since we are talking about AMD’s X-series processor, it also has the company’s Extended Frequency Range (XFR) feature for an added performance boost.

Originally priced at $329, AMD’s Ryzen now costs $199.99 at Amazon because of its Prime Day deals, which is also the current price of the ‘slower’ AMD Ryzen 7 2700 that lacks the XFR capability.

AMD Ryzen 2000-Series CPUss
  Ryzen 7 2700X Ryzen 7 2700 Ryzen 5 2600X Ryzen 5 2600
CPU Cores/Threads 8 / 16 8 / 16 6 / 12 6 / 12
Base CPU Frequency 3.7 GHz 3.2 GHz 3.6 GHz 3.4 GHz
Turbo CPU Frequency 4.3 GHz 4.1 GHz 4.2 GHz 3.9 GHz
TDP @ Base Frequency 105 W 65 W 95 W 65 W
L1 Cache I: 64K. D: 32K I: 64K. D: 32K I: 64K. D: 32K I: 64K. D: 32K
L2 Cache 512 KB/core 512 KB/core 512 KB/core 512 KB/core
L3 Cache 16 MB 16 MB 16 MB 16 MB
DRAM Support DDR4-2933
Dual Channel
DDR4-2933
Dual Channel
DDR4-2933
Dual Channel
DDR4-2933
Dual Channel
PCIe Lanes (CPU) 16 Free + 4 NVMe 16 Free + 4 NVMe 16 Free + 4 NVMe 16 Free + 4 NVMe
Original MSRP $329 $299 $229 $199
Price at Press Time $199 $199 $159 $139
Bundled Cooler AMD Prism RGB AMD Spire RGB AMD Spire AMD Stealth

To make the deal even more attractive, the Ryzen 7 2700X comes with AMD’s Prism RGB cooling system, which is rated for a 105 W TDP.

Keep in mind that since this is a part of Amazon’s Prime Day campaign, the day is eligible for around ~35 hours after press time, so make it quick if you want the Ryzen 7 2700X for $199.99.

Related Reading:

Source: Amazon

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https://imchealthcheckup.com/?win=show/14643/amds-eightcore-ryzen-7-2700x-now-available-for-200 Mon, 15 Jul 2019 15:00:00 EDT tag:www.anandtech.com,14643:news
Next Generation Intel Atom Tremont: Potential L3 Cache Dr. Ian Cutress

Intel has already disclosed that it will have a next generation Atom core, code named Tremont, which is to appear in products such as the Foveros-based hybrid Lakefield, as well as Snow Ridge designed for 5G deployments. In advance of the launch of the core and the product, it is customary for some documentation and tools to be updated to prepare for it; in this case, one of those updates has disclosed that the Tremont core would contain an L3 cache – a first for one of Intel’s Atom designs.

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https://imchealthcheckup.com/?win=show/14640/next-generation-intel-atom-tremont-potential-l3-cache Mon, 15 Jul 2019 08:00:00 EDT tag:www.anandtech.com,14640:news
Qualcomm Announces Snapdragon 855 Plus: A Higher Bin SKU Andrei Frumusanu

Today Qualcomm is announcing a new small refresh of the Snapdragon 855 SoC: the new Snapdragon 855+. In the past Qualcomm had the habit of sometimes refreshing their flagship SoCs in the middle of their product life and give them a small performance boost, probably the most known chip fitting this pattern was the Snapdragon 821 from a few years ago. The S835 never got an upgrade, however the S845 last year did get a higher bin variant which ended up in a few vendor’s products, including the renamed Snapdragon 850 product that featured the same specifications.

Qualcomm Snapdragon Flagship SoCs 2019
SoC Snapdragon 855

Snapdragon 855+

CPU 1x Kryo 485 Gold (A76 derivative)
@ 2.84GHz 1x512KB pL2

3x Kryo 485 Gold (A76 derivative)
@ 2.42GHz 3x256KB pL2

4x Kryo 485 Silver (A55 derivative)
@ 1.80GHz 4x128KB pL2

2MB sL3
1x Kryo 485 Gold (A76 derivative)
@ 2.96GHz 1x512KB pL2

3x Kryo 485 Gold (A76 derivative)
@ 2.42GHz 3x256KB pL2

4x Kryo 485 Silver (A55 derivative)
@ 1.80GHz 4x128KB pL2

2MB sL3
GPU Adreno 640 @ 585MHz Adreno 640 @ ~672MHz
Memory 4x 16-bit CH @ 2133MHz
LPDDR4x
34.1GB/s

3MB system level cache
ISP/Camera Dual 14-bit Spectra 380 ISP
1x 48MP or 2x 22MP
Encode/
Decode
2160p60 10-bit H.265
HDR10, HDR10+, HLG
720p480
Integrated Modem Snapdragon X24 LTE
(Category 20)

DL = 2000Mbps
7x20MHz CA, 256-QAM, 4x4

UL = 316Mbps
3x20MHz CA, 256-QAM
Mfc. Process 7nm (N7)

The new Snapdragon 855+ today closely follows this pattern: It’s overall the same SoC as the Snapdragon 855, however Qualcomm is raising the clocks of the Prime CPU core from 2.84GHz to up to 2.96GHz, giving a 4.2% boost for single-threaded workloads.

Along the CPU boost, we also find that the GPU is receiving a larger 15% performance boost. As the Adreno 640 in the 855 was clocked in at 585MHz, the clock on the 855+ has to be around the 672MHz mark, which is an oddly familiar frequency of Adreno GPUs.

Qualcomm states that we should expect hearing about vendor devices using the new Snapdragon 855+ in the next few weeks. Last year, ASUS was the first vendor to announce the ROG Phone using a higher binned S845 around the same summer time-period, and now the company has confirmed that the ROG Phone II will be also the first to use the new S855+.

I’m also guessing that it’s possible that Samsung’s upcoming Note10 to be powered by the S855+ as I’m expecting the phone to come with a new Exynos chipset this time around, and the Snapdragon counterpart getting a small boost as well would also make sense.

Related Reading:

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https://imchealthcheckup.com/?win=show/14641/qualcomm-announces-snapdragon-855-plus-a-higher-bin-sku Mon, 15 Jul 2019 07:30:00 EDT tag:www.anandtech.com,14641:news
No, AMD Still Isn’t Enabling PCIe 4 On 300/400 Series Boards Ryan Smith

Following this week’s launch of AMD’s new Ryzen 3000 series of processors, reports have once again begun circulating that PCIe 4 will be available on some existing 300 & 400 series boards. This comes despite AMD’s official statement last month that they would not be allowing the feature on older boards, as PCIe 4’s tighter signal integrity standards would have led to, at best, a highly fragmented market where some boards work, some boards don’t, and some boards may be outright marginal. At the time the company stated that the feature would be stripped from the AGESA that goes into the final Ryzen 3000 launch BIOSes for older boards.

So, to get right to the heart of matters, I reached out to AMD PR this evening to find out what’s going on with PCIe 4 support. The short version then is that no, AMD’s plans have not changed: PCIe 4 support will be disabled in the shipping AGESA for these boards.

Our plan is unchanged. For the reliability and consistency reasons cited at Computex, we still intend to disable PCIe Gen 4 for pre-X570 motherboards. That AGESA is being released to motherboard manufacturers soon.

As things stand, any boards that currently support the feature would be using pre-release AGESAs, and as we’ve seen with our own BIOS issues, the Ryzen 3000 BIOS situation is still evolving fast. So with AMD intending to permanently disable the feature – and prevent any workarounds – AMD’s goals haven’t wavered. At best, the few boards that have beta BIOSes with the feature will lose them in the future, unless users opted to stick with an unsupported (and almost certainly buggy) BIOS.

Going forward, proper PCIe 4 support will continue to require an AMD 500-series board specifically designed to meet the signal integrity requirements for the higher speed standard. Right now, this includes boards based on AMD’s X570 chipset; and while the company hasn’t announced other 500-series chipsets, we’re expecting to see more in due time.

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https://imchealthcheckup.com/?win=show/14639/no-amd-still-isnt-enabling-pcie-4-on-300400-series-boards Fri, 12 Jul 2019 22:00:00 EDT tag:www.anandtech.com,14639:news
Dynabook’s USB-C Dock Has 10 Ports & an SD Reader Anton Shilov

Dynabook Americas (former Toshiba) has introduced its new multi-port USB-C docking station. The USB-C Dock is designed to bring 10 ports and an SD card reader to ultra-portable laptops that have limited number of wired connectivity options. 10 ports do not come cheap though.

The Dynabook USB-C Dock carries a GbE adapter, four USB 3.1 Type-A connectors (one supports charging), one USB 3.1 Type-C port, an SD Card reader, and a 3.5-mm audio jack for headsets. The docking stations can support up to three Full-HD displays using its DisplayPort, HDMI, and D-Sub outputs, or one 4K monitor using the DP 1.4 output.

The USB-C Dock comes with a power connector supporting 20V chargers, so it is likely that its USB-C port can also deliver a sufficient amount of power to charge modern notebooks, but Dynabook does not disclose its Power Delivery rating.

Dynabook’s USB-C Dock will be available in the near future for $199.99, which is comparable to similar Thunderbolt 3 docking stations and is considerably more expensive when compared to USB-C docks without Power Delivery from less well-known manufacturers.

There may be two reasons why the USB-C dock is more expensive though; cheap USB-C docks often come with DisplayPort and HDMI connectors that only support 4K30 output, which is not good enough for comfortable use over long periods of time. Given the high price of the Dynabook USB-C dock, we can hope that this device will actually support at least one 4K60 output. Furthermore, the Dynabook USB-C Dock should be able to deliver power to laptops, which also adds to the cost and MSRP.

Related Reading:

Source: Dynabook Americas

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https://imchealthcheckup.com/?win=show/14638/dynabooks-usbc-dock-has-10-ports-an-sd-reader Fri, 12 Jul 2019 14:00:00 EDT tag:www.anandtech.com,14638:news
The Return of the Portégé: Dynabook Launches 2019 Portégé X30 Anton Shilov

Because of the corporate turmoil in 2016 – 2018 and uncertain future of its PC business, Toshiba has not updated its popular Portégé family of notebooks in the US for more than two years. After Foxconn/Sharp gained control of the said business unit and renamed it to Dynabook, they started to launch new laptops. Among the first new mobile PCs to be released in the USA are the 2019 Portégé X30 notebooks with Intel’s Whiskey Lake CPUs.

Traditionally, Portégé X30 machines have been aimed at demanding business, enterprise, and government users seeking both portability as well as rich feature sets. The new Portégé X30 is not an exception: the system comes in a familiar Onyx Blue magnesium allow chassis that enables it to bring together high performance, connectivity, security, and a weight that is among the lowest in the 13.3-inch class. Just like its direct predecessor from 2017, Dynabook’s new Portégé X30 weighs 1.05 kilograms (2.31 lbs) and is 15.9 mm thick.

When it comes to internals, the new Portégé X30 packs Intel’s 8th Gen Core i3/i5/i7 processor with built-in UHD Graphics 620 that is accompanied by 8, 16 GB or 32 GB of DDR4 memory as well as up to 1 TB SSD (SATA or PCIe). The CPU is now cooled down using a new quieter S-Type fan and a new cooling system that enables better airflow.

As far as connectivity is concerned, the new laptops are equipped with a Wi-Fi 5 + Bluetooth 5 wireless module, an optional 4G/LTE (select models only) modem, two Thunderbolt 3 ports that can work in DisplayPort and USB 3.1 Gen 2 modes, one USB Type-A connector, one HDMI output, a microSD card reader, and a 3.5-mm audio jack. Traditionally for Toshiba X-series notebooks, the Portégé X30 comes with a backlit, spill-resistant keyboard with a trackpoint nub that complements the touchpad. As for multimedia capabilities, the PC has a stereo sub-system comprising speakers co-designed with Harman Kardon that also carry a DTS badge.

Being aimed at customers who value security and reliability, the Portégé X30 comes equipped with SecurePad with Synaptics Natural ID fingerprint sensor, a webcam with IR sensors (for Windows Hello facial recognition) as well as a Trusted Platform Module (TPM 2.0).

Dynabook's Portege X30
  General Specifications
Display 13.3" 1920×1080
13.3" 1920×1080 with 10-point multitouch
CPU Core i3-8145U
Core i5-8265U
Core i5-8365U
Core i7-8565U
Core i7-8665U
Graphics HD Graphics 620 (24 EUs)
RAM 8/16/32 GB DDR4
Storage Up to 1 TB SSD (SATA or PCIe)
Wi-Fi Wi-Fi 5 (802.11ac)
Bluetooth Bluetooth 5
USB 3.0 × Type-A
TB3 2 × Type-C TB3/USB 3.1 ports (also used for charging, external display, etc.)
Card Reader MicroSD
Fingerprint Sensor Yes
Other I/O Webcam with RGB + IR sensors, microphone, stereo speakers, audio jack
Battery 48 Wh (?)
Thickness 15.9 mm (0.62 inches)
Weight Starting at 1.05 kg (2.31 lbs)
Price ?

Dynabook’s Portégé X30 come with an international three-year warranty, which will certainly please frequent travelers. Dynabook Americas will start sales of the new laptops in August (in time for BTS season) at prices that will depend on exact configurations.

Related Reading:

Source: Dynabook Americas

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https://imchealthcheckup.com/?win=show/14637/the-return-of-the-portg-dynabook-launches-2019-portg-x30 Fri, 12 Jul 2019 13:00:00 EDT tag:www.anandtech.com,14637:news
SanDisk’s Extreme Pro NVMe 3D SSD Gains Capacity: Up to 2 TB Anton Shilov

Western Digital has quietly expanded its SanDisk Extreme Pro M.2 NVMe 3D SSD range with a 2 TB model. The drive offers performance on par with other models in the family as well as the company’s WD Black SN750. The launch indicates that the SanDisk brand is still very popular among end users and 2 TB capacity is gaining popularity.

Earlier this year Western Digital introduced its WD Black SN750 and SanDisk Extreme Pro M.2 NVMe 3D SSDs based on its in-house developed controller as well as 64-layer 3D TLC NAND memory. Both families feature the same components, the same levels of performance, and even come with similar dashboard software. Meanwhile, the WD Black SN750 family included 250 GB, 500 GB, 1 TB, and 2 TB models, whereas the SanDisk Extreme Pro M.2 NVMe range is comprised of only 500 GB and 1 TB SKUs.

One of the reasons why Western Digital could decide not to include a 2 TB model into the SanDisk Extreme Pro range was the positioning of the brand. While the WD Black is aimed at gamers and performance enthusiasts, the SanDisk brand is mostly targeted at retail users (which doesn't exclude SanDisk products from being online), and therefore the manufacturer needed to limit itself to the most popular capacities because of the shelf space.

As it turns out, the company has changed its mind and quietly launched its SanDisk Extreme Pro M.2 NVMe 2TB SSD in Austria, Germany, and Japan. Pricing of the drive in the Land of the Rising Sun is unclear, whereas in Austria and Germany the device costs from €466 to €570.

Performance wise, the SanDisk Extreme Pro M.2 NVMe 2 TB offers up to 3400 MB/s sequential read speed, up to 2900 MB/s sequential write speed, up to 480K random read IOPS as well as up to 550K random write IOPS. While the drive offers the same speeds as the WD Black SN750, it does not come with an optional heatsink and therefore real-world performance of the SSDs may vary under high loads.

SanDisk Extreme Pro M.2 NVMe SSD Specifications
Capacity 250 GB 500 GB 1 TB 2 TB
Form Factor M.2 2280 single-sided
optional heatsink (except 250GB)
Interface PCIe 3 x4 NVMe 1.3
Controller Western Digital in-house
NAND Flash SanDisk 64-layer 3D TLC
Sequential Read 3100 MB/s 3470 MB/s 3470 MB/s 3400 MB/s
Sequential Write 1600 MB/s 2600 MB/s 3000 MB/s 2900 MB/s
Random Read 220k IOPS 420k IOPS 515k IOPS 480k IOPS
Random Write 180k IOPS 380k IOPS 560k IOPS 550k IOPS
Power Peak 9.24 W 9.24 W 9.24 W 9.24 W
PS3 Idle 70 mW 70 mW 100 mW 100 mW
PS4 Idle 2.5 mW 2.5 mW 2.5 mW 2.5 mW
Warranty 5 years
Write Endurance 200 TB
0.4 DWPD
300 TB
0.3 DWPD
600 TB
0.3 DWPD
1200 TB
0.3 DWPD

Related Reading:

Sources: SanDisk Japan (via Hermitage Akihabara), Geizhals.at

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https://imchealthcheckup.com/?win=show/14636/sandisks-extreme-pro-nvme-3d-ssd-gains-capacity-up-to-2-tb Fri, 12 Jul 2019 12:00:00 EDT tag:www.anandtech.com,14636:news
VAIO’s 2-Pound 12.5-Inch Laptop Weds Miniature Dimensions & Vast Connectivity Anton Shilov

VAIO has introduced its new SX12 notebook that brings together miniature dimensions, low weight, decent specs, full-pitch keyboard, a long battery life, and vast connectivity options that include a variety of physical ports and an optional 4G/LTE modem. Unlike most 12-inch laptops, the VAIO SX12 does not use a low-power processor, but packs a fully-fledged quad-core Core i7 CPU with VAIO’s True Performance technology.

The VAIO SX12 comes in a chassis made of carbon fiber and plastic in a bid to make its weight no heavier than 897 grams as well as dimensions not significantly bigger than those of 11-inch notebooks. The mobile PC is slightly smaller than an A4 piece of paper and is around 15.7 ~ 18 mm thick. The laptop is equipped with a 12.5-inch Full-HD display with very thin bezels as well as a backlit keyboard featuring a 19-mm pitch and fluorine-containing UV curing coating.

VAIO’s SX12 laptop is based on Intel’s 8th Gen quad-core Core U-series processor with UHD Graphics 620 code-named Whiskey Lake (up to Core i7-8565U) which uses the company’s TruePerformance technology that combines an advanced cooling system as well as increased CPU power limits in order to enable the CPU to work at higher frequencies for a longer time. The processor can be accompanied by 16 GB of LPDDR3 DRAM as well as a PCIe SSD. For precise specs, check the table below.

Connectivity is one of the key selling features of the VAIO SX12 because unlike some other 12-inch class laptops, this one comes with all the necessary physical ports possible, including GbE, a USB 3.1 Gen 2 Type-C (can be used for data, display, and charging) port, one USB 3.1 Gen 2 Type-A connector, two USB 3.0 Type-A ports, an SD card reader, two display outputs (HDMI, D-Sub), a 3.5-mm audio jack, and a proprietary power port. On the wireless side of things, the laptop is equipped with a 802.11ac Wi-Fi + Bluetooth 4.1 controller as well as an optional 4G/LTE modem. In addition, it has a webcam, a fingerprint reader, stereo speakers, and a microphone.

VAIO does not disclose capacity of the battery it uses for the SX12, but says that it can last for 13 ~ 14.5 hours depending on usage, a claim that has yet to be tested in real life. Meanwhile, the laptop comes with a proprietary 200-gram charger that uses the aforementioned proprietary connector, and also has a USB port to charge the laptop and a mobile phone at the same time.

The VAIO SX12 laptops will be available in five colors, including black, silver, brown, pink, and ‘all black’ for custom special edition models.

VAIO will start selling its SX12 notebooks in Japan this week starting at $1,100. For corporate customers VAIO will offer a very similar Pro PJ laptop with appropriate functionality. It is unclear whether the new mobile PCs will be available in other countries, but VAIO sells its products in the U.S. and chances are that the SX12 will be sold outside of Japan are fairly high.

VAIO SX12 (VJS1211) General Specifications
  Black Silver Brown Pink
Display 12.5" anti-glare panel with 1920×1080 resolution
SoC Core i7-8565U
4C/8T
1.8 - 4.6 GHz
TruePerformance
UHD 620
Core i5-8265U
4C/8T
1.6 - 3.9 GHz
TruePerformance
UHD 620
Core i3-8145U
2C/4T
2.1 - 3.9 GHz
-
UHD 620
Celeron 4205U
2C/2T
1.8 GHz
-
UHD 610
RAM 8/16 GB LPDDR3 8/16 GB LPDDR3 4/8 GB LPDDR3 4/8 GB LPDDR3
Storage 256 GB, 512 GB or 1 TB NVMe 256 GB SATA
256 GB PCIe
128 GB SATA
Wireless  802.11ac Wi-Fi
Bluetooth 4.1
Optional 4G/LTE modem
I/O ports GbE
1 × USB 3.1 Gen 2 Type-C
1 × USB 3.1 Gen 2 Type-A
2 × USB 3.0 Type-A
HDMI
D-Sub
SD Card reader (UHS-I)
GbE
1×USB 3.0 Type-C
3×USB 3.0 Type-A
HDMI
D-Sub
SD Card reader (UHS-I)
Camera 720p webcam
Audio Integrated speakers
1 × TRRS 3.5-mm jack for headset
Dimensions 287.8 × 203.3 × 15.7 ~ 18 mm
Weight 888 ~ 897 grams
Battery 13 ~ 14.5 Hours
OS Windows 10 Pro Windows 10 Home
Fingerprint Yes No
Finish Black Silver Brown Pink
Availability July 2019

Related Reading:

Source: VAIO (via Liliputing)

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https://imchealthcheckup.com/?win=show/14635/vaios-2pound-125inch-laptop-weds-miniature-dimensions-vast-connectivity Fri, 12 Jul 2019 11:00:00 EDT tag:www.anandtech.com,14635:news
The MSI GE75 Raider Laptop Review: Core i9 and RTX 2080 Performance Brett Howse MSI went heavily into developing gaming products several years ago, and although the company’s laptop lineup isn’t exclusively gaming, that is by far the biggest portion of their portfolio, and as such we’ve seen some impressive laptops from MSI that offer both performance and quality ahead of their competition. Today we are looking at the latest in their “enthusiast” level of laptops with the MSI GE75 Raider. The GE range isn’t quite at the top end of MSI’s lineup – a spot that is occupied by the GT series – but it still offers prodigious portable performance without being as tied to the desk as a typical GT laptop would be.

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https://imchealthcheckup.com/?win=show/14612/the-msi-ge75-raider-laptop-review Fri, 12 Jul 2019 08:00:00 EDT tag:www.anandtech.com,14612:news
LG to Start Production of OLEDs in China Next Month, Set to Double OLED Output Anton Shilov

LG Display this week said that its plant in Guangzhou, China, would start full swing operations next month. The factory, which cost LG around $4.2 billion, will produce large OLED panels for Ultra-HD televisions. The new manufacturing capacity will nearly double LG’s output of OLED substrates and will enable the company to cut its costs.

LGD’s new 8.5G (2200×2500) OLED factory in Guangzhou will produce 60,000 substrates for large TVs per month, which will almost double output of the company’s OLED substrates to 130,000 per month. Eventually, the plant will be expanded with the second line and will increase its capacity to 90,000 substrates per month.

One of the world’s largest makers of OLED panels first announced plans to build a plant in China in mid-2017. It took LG Display a year to obtain necessary permissions from the Chinese and South Korean governments and then a year to build the factory. This month the company starts trial production and next month mass production is set to commence

LG Display invested about $4.2 billion in its Guangzhou facility, but it hopes the expenses will pay off. Firstly, there are lower wages in China when compared to South Korea. Secondly, subsidies from the Chinese government will enable LG to cut its depreciation costs by 65%. Thirdly, the new fab could allow LG to offset possible disruption of OLED production in South Korea because of the ongoing diplomatic conflict between Japan and South Korea. Fourthly, it will make LG Display more competitive against companies like BOE in the Chinese market.

Increased output and lower production costs will allow LG to make its OLED panels and therefore OLED TVs cheaper. Still, the exact effect is something that remains to be seen.

Related Reading:

Sources: The Investor, OLED Info

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https://imchealthcheckup.com/?win=show/14634/lg-to-start-production-of-oleds-in-china-next-month-set-to-double-oled-output Thu, 11 Jul 2019 16:00:00 EDT tag:www.anandtech.com,14634:news
AMD Ryzen 3000 Post-Review BIOS Update Recap: Larger ST Gains, Some Gains, Some Losses Andrei Frumusanu

It’s been a long two weeks following our AMD-review-athon weekend, culminating 7/7 with our extensive coverage of the new Ryzen 3000 series CPUs, the new Radeon RX 5700 series Navi GPUs, as well as our complete overview of X570 chipset based motherboards.

Among the things that didn’t go quite as planned for in the hectic period leading up to Sunday was the matter of launch BIOSes. Always a thorny issue with new platform launches – BIOSes are often under intensive development right up until a new platform ships – we ended up in a situation where some boards had multiple BIOS versions floating around, with performance differences among them. And, while Moore's Law may be dead, Murphy's Law is alive and well, so of course the BIOS we ended up doing our initial Ryzen 3000 testing on was not the best BIOS for the platform.

So, we want to clarify the timeline of events for how we initially tested, what we’ve re-tested, and if and how the new BIOS behavior might change our original conclusion of the Ryzen 3000 series.

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https://imchealthcheckup.com/?win=show/14632/amd-ryzen-3000-review-bios-update-recap Thu, 11 Jul 2019 14:00:00 EDT tag:www.anandtech.com,14632:news
The Noctua NH-U12A CPU Cooler Review: Big Performance in a Small Space E. Fylladitakis Today we are taking a look at Noctua's latest tower CPU cooler, the NH-U12A. It is a CPU cooler intended to fit top-tier cooling performance into a more compact 120 mm cooler, and was developed specifically for users building compact and transportable gaming systems.

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https://imchealthcheckup.com/?win=show/14621/the-noctua-nhu12a-cpu-cooler-review Thu, 11 Jul 2019 12:30:00 EDT tag:www.anandtech.com,14621:news
ASUS Dominus Extreme BIOS has Cascade Lake Xeon W-3275 & W-3275M Support Anton Shilov

ASUS has released a new BIOS version 0601 for its ROG Dominus Extreme motherboard that ‘improves PCIe compatibility’ when using Intel’s latest Xeon W processors based on the Cascade Lake architecture. The move confirms that existing extreme workstation motherboards originally developed for Xeon W-3175X (and other Skylake-SP products) will work with Intel’s latest Xeon W-3200 processors.

When ASUS launched its ROG Dominus Extreme platform several months ago, the list of supported CPUs was limited to the flagship 28-core Xeon W-3175X as well as several other Xeon Gold and Xeon Platinum processors based on the Skylake-SP design and designed to use the LGA3647 socket.

Recently the company released its new BIOS version 0509 that added support for a variety of Intel Xeon W CPUs featuring the Cascade Lake microarchitecture and a slightly different physical layout. This week the company launched another BIOS version 0601 that is designed to improve PCIe compatibility whe using Intel’s Xeon W-3275/W-3275M products unveiled in early June.

One of the key physical differences between Intel's Skylake Xeon W and Cascade Lake Xeon W processors is that the latter does not reserve 16 PCIe 3.0 lanes for on-package chips (e.g., OmniPath) but instead offers 64 PCIe 3.0 lanes to add-on cards instead. Since the LGA3647 package had all the pins necessary for 64 PCIe 3.0 lanes, but the previous-generation processors did not use them, a new BIOS release was necessary to ensure compatibility with the new Intel Xeon W-3275/W-3275M as well as other new CPUs. Whether these lanes are actually used or not is a different matter.

While it is positive to see that ASUS is taking care about compatibility with Intel Xeon W-3275/W-3275M and its motherboard for extreme workstations, what remains to be seen is whether Intel plans to offer an unlocked Xeon W-3200X for those who want overclocking.

Related Reading:

Source: ASUS (via momomo_us/Twitter)

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https://imchealthcheckup.com/?win=show/14630/asus-releases-rog-dominus-extreme-bios-with-xeon-w3275-w3275m-support Thu, 11 Jul 2019 11:00:00 EDT tag:www.anandtech.com,14630:news